ODM Capabilities & Engineering

From Architecture to Small-Volume Deployment

IGNISFORMA delivers integrated hardware engineering, FPGA/DSP, firmware, mechanical CAD, and custom electronics ODM solutions for global OEMs.

Milestone Execution Model

Turnkey Engineering Lifecycle Model

Rigorous, milestone-gated engineering phases from architecture definition to volume production without artificial timelines.

6-Phase Engineering Framework
PHASE 01
Architecture & Feasibility
PRD • Transducer Selection
PHASE 02
Hardware & High-Speed PCB
HDI PCB • EVT Prototypes
PHASE 03
Firmware & Embedded AI
Micro-DSP • TinyML INT8
PHASE 04
Mechanical & Enclosure
Thermal FEA • IP67/IP69K
PHASE 05
Validation & Certification
EMC • Climatic • Shock
PHASE 06
Volume Manufacturing
ATE Fixtures • SMT Assembly
PHASE 01 GATE: ARCHITECTURE LOCK

Concept, Architecture & Feasibility

Comprehensive feasibility analysis, sensor topology selection, compute architecture definition, component obsolescence audit, and unit economics modeling.

Key Phase Deliverables:
  • Product Requirements Document (PRD) & Signal Chain Spec
  • Sensor & Silicon Selection (MEMS, ADC, MCU/FPGA)
  • Power Budgeting, Thermal Constraints & Preliminary BOM
PHASE 02 GATE: EVT BRING-UP

Hardware Schematic & High-Speed PCB

Schematic capture, multi-layer HDI PCB layout with controlled impedance, ultra-low-noise analog front-ends (AFE), signal/power integrity (SI/PI) simulation, and EVT prototyping.

Key Phase Deliverables:
  • Complete Schematics & Multi-Layer Gerber / ODB++ Package
  • Signal Integrity (SI) & Power Plane Drop Simulation
  • Assembled EVT Prototype Units & Electrical Bring-Up Log
PHASE 03 GATE: ALGORITHM VERIFICATION

Firmware, Real-Time BSP & Embedded Micro-AI

Low-level hardware abstraction, bare-metal or RTOS drivers, frequency-domain FFT and feature extraction DSP pipelines, INT8 quantized TinyML anomaly models, and fieldbus stacks.

Key Phase Deliverables:
  • Micro-DSP Firmware & Spectral FFT/PSD Acceleration
  • Quantized TinyML Autoencoder Model Porting & Benchmarks
  • Deterministic Fieldbus Protocol Stack (SPE, CAN, RS-485, Modbus)
PHASE 04 GATE: TOOLING RELEASE

Mechanical Tooling, Thermal FEA & Enclosure

Custom SolidWorks 3D mechanical enclosure design, thermal conduction finite element analysis (FEA), internal vibration damping chassis, and custom silicone gasket tooling.

Key Phase Deliverables:
  • 3D STEP / CAD Models & Dimensioned 2D Mechanical Drawings
  • Thermal Conduction & Structural Stress FEA Simulation Reports
  • CNC Prototype Enclosures & IP67/IP69K Tooling DFM Sign-Off
PHASE 05 GATE: CERTIFICATION SIGN-OFF

Validation & Certification Engineering

Rigorous execution of pre-compliance and formal accredited laboratory testing across radiated/conducted emissions, high-voltage surge, extreme thermal cycling, and shock/vibration.

Key Phase Deliverables:
  • EMC / EMI Chamber Test Reports (EN 61000-6-2/4, FCC Part 15)
  • Climatic & Ingress Verification (IEC 60068, IP67 / IP69K)
  • Regulatory Declaration of Conformity (DoC) Technical Dossier
PHASE 06 GATE: PRODUCTION HANDOVER

DVT / PVT Pilot & Volume Manufacturing

Design and Production Validation Testing (DVT/PVT), custom Bed-of-Nails Automated Test Equipment (ATE), 3D Automated Optical Inspection (AOI), full-lot ESS burn-in screening, user manuals and comprehensive documentation dossiers, and volume manufacturing.

Key Phase Deliverables:
  • Automated Test Equipment (ATE) Fixture & Test Software
  • 3D AOI & Environmental Stress Screening (ESS) Pass Logs
  • User Manual, Hardware Integration Guide & Technical Documentation Dossier
  • Turnkey Box-Build Delivery, Serialization & Cryptographic Keys
Rigorous Industrial Qualification

Detailed Industrial Compliance & Certification Stages

Every custom ODM design undergoes rigorous qualification across six accredited testing tracks to ensure robust survivability in hostile industrial, functional safety, heavy machinery, cleanroom, and mobility environments.

TRACK 01

Electromagnetic Compatibility (EMC / EMI)

EN 61000-6-2 • EN 61000-6-4 • FCC Part 15
  • Radiated & Conducted Emissions: 30 MHz – 6 GHz semi-anechoic chamber scans complying with FCC Class A and CE RED.
  • Electrostatic Discharge (ESD): Contact discharge ±8 kV, air discharge ±15 kV per IEC 61000-4-2.
  • Fast Transient Burst (EFT): ±2 kV on industrial power lines and ±1 kV on data lines per IEC 61000-4-4.
  • Surge Immunity: High-energy surge ±2 kV line-to-earth, ±1 kV line-to-line per IEC 61000-4-5.
TRACK 02

Environmental & Climatic Chambers

IEC 60068-2 • ISO 20653 • IP67 / IP69K
  • Operating Temperature Extremes: Continuous operation from −40 °C to +85 °C standard (extended to +105 °C for custom ODM).
  • Rapid Thermal Shock: −40 °C to +85 °C temperature transitions (under 10-second basket transfer time) per IEC 60068-2-14.
  • Cyclic Damp Heat: 95% relative humidity dwell testing at +55 °C for 21 days per IEC 60068-2-30.
  • Ingress Protection: Dust-tight IP6X and continuous water immersion IPX7; IP69K high-pressure steam-jet washdown.
TRACK 03

Mechanical Shock, Dynamics & Vibration

ISO 16750-3 • MIL-STD-810H • IEC 60068-2-6
  • Random Heavy Vibration: Multi-axis random vibration profiles up to 20g RMS (10 Hz – 2000 Hz) simulating mining haulers and locomotives.
  • Severe Mechanical Shock: 50g peak acceleration (11 ms half-sine pulse, 3 positive and negative shocks per axis) per IEC 60068-2-27.
  • Repetitive Bump & Drop: Continuous 25g repetitive bumps (1000 cycles) and 1.5-meter concrete free-drop survivability.
TRACK 04

Hazardous Area Intrinsic Safety Design

ATEX 2014/34/EU • IECEx Zone 1 / Zone 2 (Ex ia)
  • Compliance-by-Design: Hardware engineered to satisfy ATEX and IECEx Zone 1 / Zone 2 Ex ia intrinsic safety criteria.
  • Spark Ignition Energy Analysis: Internal capacitance, inductance, and stored energy limitation under double-fault conditions.
  • Galvanic Isolation & Spacing: Strict creepage and clearance distances across PCB traces and connectors per IEC 60079-11.
  • Thermal Surface Temperature: Controlled worst-case component surface temperature limiting for T4 class environments.
TRACK 05

Automotive Transients & Railway Qualification

ISO 16750-2 • ISO 7637-2 • EN 50155
  • Load Dump Surge Protection: Centralized load dump surge absorption (ISO 16750-2 pulse 5b) up to 36V DC nominal vehicle networks.
  • Transient Immunity: Protection against negative transients, ignition inductive kick, and battery reverse polarity per ISO 7637-2.
  • Railway Electronic Equipment: Designed for EN 50155 compliance covering rolling stock vibration, power interruptions, and supply variations.
  • Fire & Toxicity Safety: Material selection and conformal coatings designed for EN 45545-2 railway flammability compliance.
TRACK 06

Functional Safety Engineering & Architecture

IEC 61508 • ISO 13849-1 • ISO 26262 Readiness
  • Redundant Hardware Architecture: Engineered to support dual-channel (1oo2 / 2oo3) voting, hardware fault tolerance (HFT), and diagnostic coverage (DC).
  • FMEDA & Safety Metrics: Execution of Failure Modes, Effects, and Diagnostic Analysis (FMEDA) to calculate Safe Failure Fraction (SFF) and PFDavg/PFH targets.
  • Deterministic Interlock Isolation: Optically and galvanically isolated fast-trip cut-off circuits designed for SIL 2 / SIL 3 and PL d / PL e system integration.
  • Safety Documentation Dossier: Safety Requirements Specification (SRS), Safety Manual, and traceability matrices to support notified-body audits.
Compliance Note: Hardware is compliance-designed for global industrial, functional safety, and hazardous environments. Testing is executed in partnership with accredited ISO/IEC 17025 test facilities. Pre-qualified architectures reduce time-to-market. Final functional safety (SIL/PL) and hazardous-area certifications are application-dependent and subject to independent third-party assessment of the completed deployment loop.

1. Electronics & Low-Noise AFE

High-speed multi-layer PCB design (impedance controlled, HDI), ultra-low-noise analog frontends for micro-volt strain signals, and isolated power management.

2. FPGA & Embedded Micro-AI

RTL Verilog/VHDL for FPGA signal processing, ARM Cortex-M55 Helium DSP acceleration, TinyML edge model compression, and RTOS/Linux BSP development.

3. Mechanical & Enclosure Assembly

SolidWorks 3D CAD, thermal finite element analysis (FEA), IP67/IP69K sealing tooling, and automated optical inspection (AOI) with custom testing fixtures.

Engagement Models Comparison Matrix

Model Deliverables IP Ownership Customer Responsibility Warranty & Support
1. Product Platforms Off-the-shelf IGFO-100 & Mercury Z1 sensor nodes, standard register maps IGNISFORMA standard product IP Mechanical mounting and field wiring 2-year standard hardware warranty + firmware updates
2. Custom ODM Custom schematics, customized PCB form factor, tailored firmware BSP & mechanical tooling Agreed co-development IP or full customer assignment per contract Application PRD and field testing sign-off Multi-year lifecycle manufacturing support & RMA (per contract)
3. Turnkey Solutions Pre-commissioned sensors, edge gateways, SCADA integration, on-site/remote baseline calibration Standard platform IP with custom solution configuration scripts Physical asset access and IT network firewall routing SLA maintenance, periodic sensor recalibration & remote support

Discuss a Custom ODM Engineering Program

Engage our applications engineering team to review your technical requirements, bill of materials (BOM) targets, and deployment schedule.